IMAC 2009's April showers suggested a blooming Nepes botanical garden in the near future. And the Nepes Corporation booth did not disappoint, presenting a wide variety of flowers growing in 2009. The world's first high quality color glass for future architecture is only the starting line of this botanical garden. Since Nepes Corporation manufactures both materials and components for various semiconductor parts, their internal synergy effect has created a blooming convergence of ideas in the high-end market.

Combining New and Old

Nepes is known for its work with Sony, Samsung, and Sharp regarding display technology in the semiconductor industry. Sony especially has been using Nepes' LCD panels exclusively. "This component at the edge of display monitors enables the image to appear on the screen, and it must be thin and foldable to fit the frame of the screen," said CEO Lee.
Flip Clip Bumping
Nepes' flip clip bumping technology provides a solution for bulky semiconductor chips. The semiconductor packaging and electrical testing technology of Nepes is applicable to TCP/COF, COG, and CSP. The solution is based on the fine pitch flip-chip bonding and wafer slimming technology. The booth displayed this new material solution to protect chips including epoxy molding compounds and clear molding compounds.
The Nepes booth also presented an air purifier that sterilizes germs and bacteria while removing bad odors. The product will be largely marketed to Japan. "Applying this technology, we have made a medical Band- Aid. It was recently approved by the Korea Food and Drug Administration, and is scheduled to be supplied to Korean pharmaceutical companies in May," added Lee.