The cooperation leverages the highly secure Trusted Execution Environment (TEE) on smart mobile devices. The innovative concept sees applications’ sensitive components and data securely transmitted, stored and executed in a hardware protected area on the main processor of mobile devices. It helps application developers deliver products and services that meet increased security requirements without impacting flexibility and productivity.
Symantec plans to update its mobile applications so that they leverage G&D’s Trusted Service Manager (TSM) and the underlying TEE to protect cryptographic keys and credentials. This integration will yield an unprecedented level of security for Symantec's mobile security apps. Symantec’s first such application will be an ultra-secure version of Symantec Validation and ID Protection Service (VIP) two-factor authentication, which enables users to gain an added level of security when logging into important cloud-based services. The application is expected to be available the second half of 2013.
“This collaboration enables Symantec’s products and services to deliver critical security solutions leveraging highly secure hardware components in mobile devices,” said Stephen Trilling, Symantec senior vice president and chief technology officer. “We’re pleased that Symantec’s VIP Service will be the first to utilize this secure store to deliver additional value to our customers who use our service to give their mobile users secure access to sensitive applications and data.”
“At the same time, the simple activation process makes it easy and cost effective for companies to integrate mobile protection into their IT infrastructures to meet their needs,” says Wolfgang Decker, group vice president at G&D. “Our collaboration shows that flexibility and security are not necessarily mutually exclusive,” Decker adds.
Symantec and Giesecke & Devrient will be demonstrating the solution to an audience of interested specialists at the Mobile World Congress at their booths, 5C85 in hall 5 and 6D70 in hall 6.
