Seoul Semiconductor developed a new concept ultra-small LED which can generate brighter light than existing ones.
This LED was developed without using the packaging process where the LED chip is attached into a frame and electronic signals are exchanged through wire bonding.
The new LED is expected to be applicable not only for indoor and outdoor lights but for wearable electronics.
The WICOP 2 which Seoul Semiconductor revealed in Shanghai on September 15 is an LED without using the packaging process. The WICOP 2 is a follow-up model of the WICOP 1 which was developed in 2013 for use in IT devices. The application of the WICOP1 was limited to LCD BLUs, camera flash, and car headlights. The WICOP 2 is expected to contribute to greatly expanding the application areas.
Seoul Semiconductor officials said that the WICOP 2 is expected to bring about a big change throughout the LED industry since it eliminated the need for using parts and components which have been used over the past 20 years by the LED packaging industry.
